Aspocomp Group Plc, Stock Exchange Release, September 23, 2026 at 10:00 a.m. EEST
Aspocomp’s financial reporting and Annual General Meeting in 2027
Aspocomp Group Plc will publish its financial information in 2027 as follows:
Financial Statements Release 2026: Tuesday, February 23, 2027, at around 9:00 a.m.
Interim Report January-March, 2027: Tuesday, April 27, 2027, at around 9:00 a.m.
Half-year Report January-June, 2027: Tuesday, August 10, 2027, at around 9:00 a.m.
Interim Report January-September, 2027: Tuesday, October 26, 2027, at around 9:00 a.m.
Aspocomp's silent period commences 30 days prior to the publication of its financial information.
Annual Report 2026
Annual Report 2026 will be published on Tuesday, March 2, 2027. The Annual Report contains Financial Statements, the report of the Board of Directors and Auditor’s Report.
Annual General Meeting 2027
Aspocomp’s Annual General Meeting 2027 is scheduled for Wednesday, April 28, 2027, at 10:00 a.m. Finnish time. The meeting will be convened by the company’s Board of Directors later on.
Shareholders who wish to have an issue on the agenda of the AGM, shall notify the company’s Board of Directors in writing on Friday, January 22, 2027, at the latest by mail to address Aspocomp Group Plc., AGM, Keilaranta 1, 02150 Espoo, Finland or by email to yhtiokokous(at)aspocomp.com.
ASPOCOMP GROUP PLC
Manu Skyttä
President and CEO
For further information
Manu Skyttä, President and CEO, Aspocomp Group Plc
tel. +358 20 775 6860
manu.skytta(at)aspocomp.com
Aspocomp – heart of your technology
A printed circuit board (PCB) is used for electrical interconnection and as a component assembly platform in electronic devices. Aspocomp provides PCB technology design, testing and logistics services over the entire lifecycle of a product. The company’s own production and extensive international partner network guarantee cost-effectiveness and reliable deliveries.
Aspocomp’s customers are companies that design and manufacture telecommunication systems and equipment, automotive and industrial electronics, and systems for testing semiconductor components for security technology. The company has customers around the world and most of its net sales are generated by exports.
Aspocomp is headquartered in Espoo and its plant is in Oulu, one of Finland’s major technology hubs.
www.aspocomp.com